The new ioXt platform will deliver a suite of robust tools and services designed to empower manufacturers in securely developing, deploying, and managing smart devices. Key features of the ioXt Secure IoT PaaS include:

– Device Integration: Simplified processes to seamlessly integrate various sensors, actuators, and connectivity modules into your products.

– Smart Device Management: Centralized control over device firmware updates, configuration settings, and operational status.

– Scalable Architecture: Support for a vast number of devices and users, ensuring that your smart products can grow alongside your business.

This strategic investment in Secure IoT PaaS underscores ioXt’s commitment to driving innovation and security in the IoT landscape. By offering a platform that enhances the security and management of smart devices, ioXt aims to set new industry standards and provide manufacturers with the tools they need to succeed in a connected world.

ioXt remains the gold standard for IoT security, continuing to lead the industry with its trusted certification and now, with its cutting-edge Secure IoT PaaS.

For more information, please visit www.ioxtalliance.org.

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Lantronix Inc. (NASDAQ: LTRX), a global leader in compute and connectivity IoT solutions, today announced the launch of its new next-generation desktop or 1U rack mountable EDS5000 series of device servers, supporting 8, 16 or 32 serial managed devices over Ethernet (10/100/100BASE-T or 100/1000 SRP) for easy remote access and management of any serial-based equipment, such as medical devices, POS terminals or security equipment.

“With continued adoption of industrial automation and increasing demand for remote environments, Lantronix is leading the charge by offering a new family of world-class device servers that enable its customers to maintain and expand serial connections over Ethernet for better management and visibility,” said Mathi Gurusamy, chief strategy officer for Lantronix. “With this new family of device servers, Lantronix is poised to meet growing market demand for secure, remote device server solutions.”

The global serial device server market size will reach $401.47 million by 2028, up from $270.59 million in 2022, according to Maia Research Analysis’ Global Serial Device Server Market Report published in 2022.

Key features of the EDS5000 series servers include:

• IPv6 technology for faster serial speeds than previous EDS versions (921K vs 230K Baud).
• RS232, RS422 and RS485 support, which allows for multiple serial protocols to be supported in a single solution, eliminating the need for separate devices for each protocol.
• Redundant power inputs, one AC input and one DC allowing for installation in a variety of environments based on power availability. AC and DC can also be used concurrently for redundancy.
• Ethernet connection via 10/100/1000 copper RJ45 or 100/1000 SFP to support a variety of LAN/WAN options in a single solution. It can connect via copper Ethernet when it’s less than 100 meters in distance, and the Fiber SFP port can be used for distances beyond 100 meters or for additional security.
• Wide operating temperature of -10°C to +60°C to accommodate most installation environments.
• Comprehensive Device Security Framework, delivering enterprise-level security with an unprecedented level of intelligence and safety with SSL/TLS, AES and SSH built in.
• Easy set-up and configuration using Lantronix’s Windows-based Provisioning Manager, which can be used locally or remotely with the Lantronix Percepxion device management platform, providing single-pane-of-glass cloud management.

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Revolutionizing AIoT with Wi-Fi HaLow Mesh 
Paul Lai, CEO of AsiaRF, states, “The launch of our revolutionary Wi-Fi HaLow Mesh technology sets a new standard for AIoT connectivity. Our firm commitment to enhancing wireless infrastructure paves the way for innovative global partnerships.”

Strategic Collaboration and Standards Development 
As proactive participants in the Wi-Fi Alliance and Wireless Broadband Alliance, AsiaRF is instrumental in shaping the new standards for Wi-Fi HaLow Mesh architecture. Future publications, including a white paper featuring case studies on the practical applications of HaLow Mesh technology in U.S. collaborations, will further promote this innovative architecture.

Key Features of Wi-Fi HaLow Mesh Technology:

• Extended Coverage and Stability: Utilizes advanced frequency and modulation techniques to maintain reliable connections in challenging environments.
• Robust Mesh Network: Features automatic routing and backup paths, ensuring network resilience and seamless connectivity.
• Scalability for Major IoT Projects: Supports a broad spectrum of AIoT applications, fulfilling the demands of smart city infrastructure.

Compliance and Certification
AsiaRF’s Wi-Fi HaLow Mesh Gateway has received Wi-Fi HaLow certification from the Wi-Fi Alliance, affirming its industry compliance and reliability. Powering these devices, Morse Micro’s Wi-Fi HaLow chips are at the core of AsiaRF’s Wi-Fi HaLow module MM610X-001, known for their ultra-low power consumption and long-range capabilities, ideal for IoT applications.

The Wi-Fi HaLow module MM610X-001 complies with international regulations, including the FCC, IC, CE, and Japan’s TELEC, ensuring it meets stringent global safety standards. AsiaRF’s full range of Wi-Fi HaLow Mesh gateways, which includes the Wi-Fi HaLow Mesh indoor gateway (ARFHL-AP), Wi-Fi HaLow Mesh portable gateway (ARFHL-UM), and Wi-Fi HaLow Mesh outdoor model (ARFHL-OD), also adheres to these standards, ensuring robust and secure wireless networking for diverse AIoT environments.

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InnoPhase IoT, Inc., a fabless semiconductor company specializing in ultra-low power Wi-Fi IoT solutions, announces the availability of its Talaria TWO Matter v1.2 certified Wi-Fi solution. It is based on a single-chip SoC compared with the multiple-chip approach taken by many vendors. The Matter protocol addresses the need for vendor-independent device compatibility, easy setup, and operation. This allows the Talaria TWO Matter 1.2 solution to enable device interoperability across a variety of ecosystems, including Apple, Google, Amazon Alexa, Samsung, etc., providing a wider selection of home automation devices for smart home users.

“By 2030, ABI Research expects more than 1.5 billion Matter-compliant smart home devices to ship annually, many of which will be battery powered,” says Andrew Zignani, Senior Research Director, ABI Research. “InnoPhase IoT’s Talaria TWO solution combines its ultra-low power Wi-Fi with support for Matter 1.2 specification to deliver enhanced interoperability and extended battery life to key smart home IoT applications such as Wi-Fi enabled smart door locks, lighting, thermostats, and sensor solutions. This will be critical in providing an enhanced customer experience, up to 4x improvement in battery life, seamless provisioning via Bluetooth Low Energy (BLE), and high levels of security.”

The Matter stack runs on the Talaria TWO SoC for both standalone and microcontroller (MCU) host configurations. The standalone operation provides the most power, size, and cost-efficient option. Flexibility is provided by allowing customers to use an external MCU host by offloading Matter protocol processing onto the Talaria TWO SoC so that developers can use MCU processing and memory resources specifically for custom applications. It also allows for the selection of a Cortex-M0 to Cortex-M85-based processor that is appropriate for the application. With a Matter over lowest-power Wi-Fi approach, rather than Matter over Thread, the Talaria TWO solution delivers a direct connection to the cloud/internet, eliminating the need and cost of a bridge border router.

The Talaria TWO Matter full-stack software development kit, SDK 3.1, is based on FreeRTOS and provides edge-to-cloud software for custom IoT applications, a GCC toolchain, and an eclipse-based IDE for software development. It also includes Matter 1.2 reference applications profiles for smart lighting and door locks with support for Amazon’s AWS and Microsoft Azure platforms. Additional profiles will be released in Q3 2024. The Talaria TWO Matter SDK3.1 is supported on the standalone Talaria TWO Evaluation Kit, as well as reference designs combining Talaria TWO modules with the Nuvoton M251 and Nuvoton M2354 MCU series hosts. The solution is scalable to other MCUs through a HAPI interface between Talaria TWO and MCU hosts.

“Nuvoton is excited to be working with InnoPhase IoT to deliver Matter 1.2 solutions,” said Chad Wu, Nuvoton Vice President of the Microcontroller Business Group. “Combining Nuvoton’s highly secure NuMicro® microcontrollers and microprocessors with InnoPhase IoT’s ultra-low power Talaria TWO Wi-Fi/BLE modules in a Matter reference design notably speeds up market entry for smart home device customers, enabling a rapid launch advantage.”

“Achieving Matter 1.2 certification is a game changer in secure device connectivity, ensuring that smart-home devices work together seamlessly,” said Wiren Perera, InnoPhase IoT President and COO. “Our Talaria TWO delivers Wi-Fi at ultra-low power levels synonymous with shorter range technologies, unleashing truly untethered secure IoT devices. Next, it was important to provide manufacturer and ecosystem-independent interoperability for consumers. A scalable Matter 1.2 certified capability addresses this challenge for a wide range of smart-home applications from appliances through entertainment and comfort to utilities and services,” Perera added.

The Talaria TWO Matter v1.2 solution is currently available. Customers can purchase the evaluation kit from InnoPhase IoT and its distributors and the M251+T2 and M2354+T2 reference designs from Nuvoton distributors. Matter SDK3.1 is available from the InnoPhase IoT website customer portal. Contact sales@innoPhaseiot.com for demonstrations.

InnoPhase IoT will showcase its Matter 1.2 certified solutions at Sensors Converge in Santa Clara, CA, June 24-26 at booth #917. Deepal Mehta, Senior Director of Marketing and Business Development, will present on the Cloud-To-Edge Architecture panel on Tuesday, June 25 at 3:20 p.m.

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Soracom, Inc., a global provider of advanced Internet of Things (IoT) connectivity, today announced that it has joined the Amazon Web Services (AWS) Independent Software Vendor (ISV) Accelerate Program, a co-sell program for AWS Partners that provides software solutions that run on or integrate with AWS.

Soracom’s fully virtualized, cost-effective global platform provides full MVNO capability for cellular along with a powerful connectivity management platform, zero-touch provisioning services, secure networking capabilities, “single pane of glass” control for additional connectivity options including LPWA, Wi-Fi, and satellite, and advanced integrations with AWS.

“Soracom’s deep integration with AWS services and functions gives our customers an unfair advantage as they build and scale IoT deployments worldwide,” said Richard Halliday,Head of Sales and Partnerships, Americas at Soracom. “As an AWS IoT Competency Partner since 2016, Soracom already connects millions of IoT devices to AWS. We’re thrilled to join AWS ISV Accelerate and continue working with AWS to drive IoT growth around the world.”

Whether launching new products and services or hardening million-scale deployments, Soracom customers can count on leading-edge technical capabilities and expert solutions support to help anticipate challenges in the field and reduce the cost of operating IoT networks at scale.

Soracom smart cellular connectivity for IoT has been available through the AWS Marketplace since 2019, and Soracom also participates in AWS Marketplace Private Offers. Joining the ISV Accelerate program ensures that Soracom will be able to offer an even wider array of commercial options designed to support long-term success for customers ready to take advantage of Soracom and AWS for their IoT deployments.

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Baya Systems today emerged from stealth mode to announce its software-driven IP technology portfolio designed to accelerate complex single-die and multi-die SoC designs. These innovations bolster the emerging chiplet economy and enable unprecedented scale for large-scale compute and AI processing.

Baya Systems technology simplifies the development process and reduces the risk, empowering designers to rapidly analyze, develop, optimize and deploy these complex systems. This enables highly energy-efficient data movement in single-die designs that can support over 4 terabyte/second throughput in a complex CPU cluster, culminating in multi-petabyte/second throughput in multi-chiplet designs for high-end AI installations.

With the exponential growth of computing requirements for artificial intelligence, best-in-class silicon vendors have consistently tried to scale performance efficiently by integrating various processors, including CPUs, GPUs, and neural network accelerators, into intelligent compute systems. This has led to a substantial challenge of efficient data movement across these different processors, and increasingly complex system and application software development. Baya Systems focuses on delivering hyper-efficient data movement that can be customized with efficient hardware-based coherency, correctness, and robustness to accelerate these platforms for applications across industries such as AI acceleration, data center, networking infrastructure, automotive and IoT.

“The rapid scaling in compute needed to support AI is bottlenecked by scaling silicon, memory, storage, and the increasingly huge amounts of data; requiring increasingly complex SoCs and chiplets,” said Kevin Krewell, Principal Analyst at TIRIAS Research. “The industry desperately needs a holistic way to design, analyze, and build intelligent fabrics to address this, and Baya seems to have the right ingredients to really drive the market forward.”

Baya Systems tackles the challenges of system design complexity, performance guarantees, high costs, and shrinking market windows in the SoC and chiplet industries. Its WeaverPro software platform supports the SoC designer from initial specification all the way to post-silicon tuning. Its WeaveIP provides components to build a unified fabric that has an extremely efficient, scalable transport architecture that maximizes performance and throughput, while minimizing latency, silicon footprint and power. Combined with advanced features for reliability and safety, this empowers designers to analyze, architect, customize, optimize and deploy complex SoCs and chiplets.

Baya’s solution is unique for the following reasons:

• Software-driven architecture exploration helps optimize design to achieve performance guarantees based on built-simulator.
• Engine to generate representative workloads from traffic specification.
• Best-in-class, flexible network that can achieve 3GHz in a 4-nanometer process technology.
• Algorithmic optimization that supports reuse and minimizes silicon and power footprints without compromising performance.
• Industry’s first IP to offer multi-level cache coherency for single/multi-die systems, radically reducing costs of coherency across these large-scale systems.
• Customizable protocol and multicast capabilities for advanced AI and CPU acceleration that support petabyte-level throughput.
• Correct-by-construction design generation that radically reduces risk of failure.
• WeaveIP supports standard protocols such as CHI, ACE5-Lite, AXI5 and extendable to others including CXL.
• Physically aware flow with modularity and tiling support for ease of implementation

“The semiconductor industry is at an inflection point in how to overcome the widening gap between memory performance and the processing needs of AI,” said Dr. Sailesh Kumar, CEO at Baya Systems. “These challenges are overwhelming the industry with design complexity, energy costs, and systems that are obsolete by the time they hit the market. Baya Systems is resolute in delivering foundational software, an industry-first, grounds-up fabric solution for future-proof multi-cluster and multi-chiplet designs, and a methodology that takes out the guesswork. I firmly believe that Baya unlocks the merchant chiplet market that is expected to grow to $107 billion by 2033.”

Baya Systems was founded by Kumar, an ex-Intel Fellow and former founder of Netspeed Systems; Dr. Eric Norige, and Joji Philip, who were also key contributors at Netspeed Systems. It is backed by leading investors Matrix and Intel Capital, and is led by Silicon Valley semiconductor veterans with extensive experience in processing and systems, who have driven important initiatives at AMD, ARM, Apple, Intel, Meta, and other leading processor companies.

“When we invest, we look for key market gaps, disruptive technologies that address them, and teams that have a compelling vision and execution muscle and the hunger to achieve it,” said Stan Reiss, general partner, Matrix Partners. “Baya tops all of them for a market that is desperate for solving the scale and chiplet problem with a technology that not just fills the gap but unleashes disruptive innovation, and a proven team that has had a consistent out-sized success in entrepreneurial and high-growth settings.”

The company makes its public debut at DAC 2024, Booth No. 2446, at Moscone West in San Francisco June 23-27.

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SUSE®, a global leader in innovative, open and secure enterprise-grade solutions, today announced that it has acquired the full stack observability platform StackState. StackState’s technology gives IT teams the fastest path to identifying and remedying issues within their containerized cloud-based environments through a single observability platform. With StackState, SUSE will accelerate cloud native observability for the enterprise by integrating the platform into Rancher Prime, its premium container management service.

SUSE CEO Dirk-Peter van Leeuwen said, “As IT environments become more complex, our Rancher Prime customers need end-to-end observability of their entire stack. StackState’s comprehensive infrastructure and application monitoring capabilities and technical talent are the perfect complement to Rancher Prime and sets up SUSE’s container management solutions to best serve our customers on their modernization journey. I know our customers will value it greatly as we roll it out.”

With the rapid adoption of cloud and containers, traditional monitoring approaches are becoming obsolete, driving the growth and need for cloud native observability. StackState’s end-to-end observability and application monitoring will be directly incorporated into SUSE’s Rancher Prime, the industry’s most widely adopted enterprise container management platform. This helps customers proactively safeguard their end-user’s experience, foster cross-team collaboration and innovation, and bring all of their cloud native applications together in a single view, from data center to the Edge to the cloud. To foster widespread adoption of cloud native observability, SUSE also announced its intention to open source StackState in the future.  

As systems and devices continue to come online at an increasing rate, there will be an equally increasing demand for AI data analytics. StackState’s technology allows users to correlate events over a period of time to help identify root causes in complex distributed systems and suggests remedial actions. StackState’s capabilities will further enhance SUSE’s portfolio, and drive overall innovation, efficiency, and value for customers. This acquisition also opens up broad opportunities for future capabilities like Cost Management, smart issue remediation, environment optimization and Industrial IoT observability.

Andreas Prins, CEO of StackState said, “I am so proud of everything the team at StackState has built since we launched. We offer unparalleled observability to customers running mission critical workloads in complex environments. SUSE’s Rancher Prime is a great fit for our technology and our team – and I’m looking forward to seeing what we have built reach its full potential.” 

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KORE, a global leader in Internet of Things (“IoT”) Solutions and pioneering IoT hyperscaler, and provider of IoT Connectivity, Solutions and Analytics, today announced Cradlepoint, the global leader in cloud-delivered LTE and 5G wireless network and security solutions, has awarded KORE the 2023 Enterprise Partner of the Year Award. Presented at Cradlepoint’s recent 2024 Global Partner Summit, the award recognizes significant achievements in partner-driven sales, solution architecture and customer service.

Cradlepoint recognizes channel partners in three categories: outstanding performance, commitment to customers and significant achievements over the last year. Each recognized channel partner has demonstrated exceptional year-over-year growth and a continued commitment to positioning and selling Cradlepoint’s entire portfolio of wireless and security solutions.

“This award is a tremendous honor for KORE. Being named Cradlepoint’s Enterprise Partner of the Year demonstrates our commitment to providing best-in-class cellular connectivity solutions for complex IoT deployments,” said Nick Gregory, director of OEM strategic partnerships for KORE. “Our team has built a deep understanding of Cradlepoint’s technology, allowing us to deliver seamless integration and exceptional service to our customers. This recognition strengthens our relationship with Cradlepoint, and together, we’re excited to unlock even more possibilities for the future of connected businesses.”

As enterprises strive to be more competitive in an evolving global economy, they are turning to new and innovative technologies that can help transform their businesses. However, innovation cannot be limited by location or complexity. Public and private cellular networking, coupled with modern security and traffic optimization, unlock new opportunities for innovative enterprises to grow their businesses anywhere with confidence. With 5G at the center of Cradlepoint’s solutions, companies can securely and efficiently create offices on wheels, use computer vision for safety and efficiency, create agile manufacturing environments and digitize business in rugged spaces.

KORE supports strategic channel partner relationships with a broad range of businesses, including major cellular operators, telecom providers, master agencies, device manufacturers, and system integrators who benefit from KORE’s differentiated, channel-focused offerings.

“The expansion of Cradlepoint’s portfolio to include private networks and our new NetCloud SASE, along with a simplified model for managed services, has enabled our partners to create a wireless-first network practice while adding on value-add services such as security and remote management,” said Eric Purcell, senior vice president of global partner sales at Cradlepoint. “We are appreciative of all of our resellers taking on new frontiers and creating unique practices that are accelerating LTE and 5G Wireless WAN and LAN adoption. KORE has worked hard to receive this recognition.”

To learn more about KORE, please visit korewireless.com. For more information on Cradlepoint’s Partner Program, visit https://cradlepoint.com/partners/for-partners/.

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Actelis Networks, Inc. (NASDAQ:ASNS) (“Actelis” or the “Company”), a market leader in cyber-hardened, rapid deployment networking solutions for IoT applications, today announced a partnership with Carahsoft Technology Corp., The Trusted Government IT Solutions Provider®. Under the agreement, Carahsoft will serve as Actelis’ Public Sector distributor, making Actelis’ hybrid-fiber connectivity solutions available to Federal, State and Local agencies, and Educational organizations in the U.S. and Canada through Carahsoft’s reseller partners and NASA Solutions for Enterprise-Wide Procurement (SEWP) V and OMNIA Partners contracts.

“Our new partnership with Carahsoft is a big step forward for Actelis as we look to expand the use of our solutions within Government networks,” said Tuvia Barlev, Chairman & CEO of Actelis. “Carahsoft is highly respected in the Public Sector and has a strong network of resellers and integrators who can benefit from our hybrid-fiber approach to enable instant and secure connectivity for their customers.”

Actelis’ proven solutions help Government agencies significantly reduce project timelines and costs associated with deploying IoT devices and systems. With patented connectivity technology designed to operate within fiber networks, and the unique capability to boost the performance of copper and coax infrastructure to fiber-grade, Actelis helps users maximize their existing network assets. The company’s technology is currently deployed across hundreds of cities around the globe and is used for smart city and intelligent transportation applications, the acceleration of military base modernization, utilities monitoring and high-speed internet connectivity.

“Carahsoft and our reseller partners are pleased to work with Actelis to provide our joint customers with highly flexible connectivity solutions that expedite the completion of their Government networking projects,” said Lacey Wean, Sales Executive for Smart Cities Technology Solutions at Carahsoft. “The Actelis solution is a unique contribution to our portfolio, and we look forward to working with their team to identify how agencies can maximize the infrastructure they already have to support additional network modernization initiatives.”

Actelis’ solutions are available through Carahsoft’s SEWP V contracts NNG15SC03B and NNG15SC27B and OMNIA Partners Contract #R191902. For more information, contact the Carahsoft team at (844) 722-8436 or Actelis@carahsoft.com.

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At the show, Quectel will be highlighting their satellite module capabilities, showcasing the CC660D-LS, CC200A-LB and BG95-S5 satellite modules;

• The CC660D-LS is a 3GPP NTN (Non-Terrestrial Network) satellite communication module that supports 3GPP Rel-17 (IoT-NTN) at L-band (B255) and S-band (B256/23) frequencies for satellite communications.
• The CC200A-LB is a satellite communication module designed for remote areas without cellular network coverage. It provides reliable global connectivity over the IsatData Pro (IDP) satellite service and features two-way communication, low latency, and nearly real-time reporting capabilities.
• The BG95-S5 is a 3GPP NTN (Non-Terrestrial Network) satellite communication module that supports 3GPP Rel-17 (IoT-NTN) at S-band (B256/B23) and L-band (B255*) frequencies for satellite communications. It also offers multi-mode support for LTE Cat M1/Cat NB2/EGPRS and includes integrated GNSS.

Quectel will also be showcasing an extensive array of LTE, Smart, Short-range, LPWA, GNSS, and Automotive modules, along with their corresponding antenna options. Visitors to the Quectel booth can look forward to gaining valuable insights into the latest trends in IoT technologies and discovering how Quectel is leading innovation and advancement in this field.

Attendees can also look forward to a wide range of demonstrations at the booth, showcasing customer devices utilizing Quectel products, including:

• Cybertec: Discover the power of RedCap technology with Cybertec’s two impressive 5G RedCap routers, featuring the high-performance RG255C-GL 5G RedCap modules.
• Landis & Gyr: Charge up with innovation through the Inch Core Home EV Charger from Landis & Gyr, featuring the versatile EG21-GL module.
• Senquip: Monitor and manage like never before with Senquip’s two advanced telemetry devices, powered by the versatile BG96 and EG91 modules.

Quectel’s team of experts will be available at the booth to discuss the latest trends in IoT and share insights on how businesses can leverage Quectel’s solutions to drive innovation and efficiency. Additionally, the team will provide live demonstrations of the products, offering a hands-on experience for attendees.

Quectel’s dedicated team of local Field Application Engineers (FAEs) and Sales professionals will be available at the event to answer any questions attendees may have.

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