The new ioXt platform will deliver a suite of robust tools and services designed to empower manufacturers in securely developing, deploying, and managing smart devices. Key features of the ioXt Secure IoT PaaS include:

– Device Integration: Simplified processes to seamlessly integrate various sensors, actuators, and connectivity modules into your products.

– Smart Device Management: Centralized control over device firmware updates, configuration settings, and operational status.

– Scalable Architecture: Support for a vast number of devices and users, ensuring that your smart products can grow alongside your business.

This strategic investment in Secure IoT PaaS underscores ioXt’s commitment to driving innovation and security in the IoT landscape. By offering a platform that enhances the security and management of smart devices, ioXt aims to set new industry standards and provide manufacturers with the tools they need to succeed in a connected world.

ioXt remains the gold standard for IoT security, continuing to lead the industry with its trusted certification and now, with its cutting-edge Secure IoT PaaS.

For more information, please visit www.ioxtalliance.org.

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Lantronix Inc. (NASDAQ: LTRX), a global leader in compute and connectivity IoT solutions, today announced the launch of its new next-generation desktop or 1U rack mountable EDS5000 series of device servers, supporting 8, 16 or 32 serial managed devices over Ethernet (10/100/100BASE-T or 100/1000 SRP) for easy remote access and management of any serial-based equipment, such as medical devices, POS terminals or security equipment.

“With continued adoption of industrial automation and increasing demand for remote environments, Lantronix is leading the charge by offering a new family of world-class device servers that enable its customers to maintain and expand serial connections over Ethernet for better management and visibility,” said Mathi Gurusamy, chief strategy officer for Lantronix. “With this new family of device servers, Lantronix is poised to meet growing market demand for secure, remote device server solutions.”

The global serial device server market size will reach $401.47 million by 2028, up from $270.59 million in 2022, according to Maia Research Analysis’ Global Serial Device Server Market Report published in 2022.

Key features of the EDS5000 series servers include:

• IPv6 technology for faster serial speeds than previous EDS versions (921K vs 230K Baud).
• RS232, RS422 and RS485 support, which allows for multiple serial protocols to be supported in a single solution, eliminating the need for separate devices for each protocol.
• Redundant power inputs, one AC input and one DC allowing for installation in a variety of environments based on power availability. AC and DC can also be used concurrently for redundancy.
• Ethernet connection via 10/100/1000 copper RJ45 or 100/1000 SFP to support a variety of LAN/WAN options in a single solution. It can connect via copper Ethernet when it’s less than 100 meters in distance, and the Fiber SFP port can be used for distances beyond 100 meters or for additional security.
• Wide operating temperature of -10°C to +60°C to accommodate most installation environments.
• Comprehensive Device Security Framework, delivering enterprise-level security with an unprecedented level of intelligence and safety with SSL/TLS, AES and SSH built in.
• Easy set-up and configuration using Lantronix’s Windows-based Provisioning Manager, which can be used locally or remotely with the Lantronix Percepxion device management platform, providing single-pane-of-glass cloud management.

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Revolutionizing AIoT with Wi-Fi HaLow Mesh 
Paul Lai, CEO of AsiaRF, states, “The launch of our revolutionary Wi-Fi HaLow Mesh technology sets a new standard for AIoT connectivity. Our firm commitment to enhancing wireless infrastructure paves the way for innovative global partnerships.”

Strategic Collaboration and Standards Development 
As proactive participants in the Wi-Fi Alliance and Wireless Broadband Alliance, AsiaRF is instrumental in shaping the new standards for Wi-Fi HaLow Mesh architecture. Future publications, including a white paper featuring case studies on the practical applications of HaLow Mesh technology in U.S. collaborations, will further promote this innovative architecture.

Key Features of Wi-Fi HaLow Mesh Technology:

• Extended Coverage and Stability: Utilizes advanced frequency and modulation techniques to maintain reliable connections in challenging environments.
• Robust Mesh Network: Features automatic routing and backup paths, ensuring network resilience and seamless connectivity.
• Scalability for Major IoT Projects: Supports a broad spectrum of AIoT applications, fulfilling the demands of smart city infrastructure.

Compliance and Certification
AsiaRF’s Wi-Fi HaLow Mesh Gateway has received Wi-Fi HaLow certification from the Wi-Fi Alliance, affirming its industry compliance and reliability. Powering these devices, Morse Micro’s Wi-Fi HaLow chips are at the core of AsiaRF’s Wi-Fi HaLow module MM610X-001, known for their ultra-low power consumption and long-range capabilities, ideal for IoT applications.

The Wi-Fi HaLow module MM610X-001 complies with international regulations, including the FCC, IC, CE, and Japan’s TELEC, ensuring it meets stringent global safety standards. AsiaRF’s full range of Wi-Fi HaLow Mesh gateways, which includes the Wi-Fi HaLow Mesh indoor gateway (ARFHL-AP), Wi-Fi HaLow Mesh portable gateway (ARFHL-UM), and Wi-Fi HaLow Mesh outdoor model (ARFHL-OD), also adheres to these standards, ensuring robust and secure wireless networking for diverse AIoT environments.

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InnoPhase IoT, Inc., a fabless semiconductor company specializing in ultra-low power Wi-Fi IoT solutions, announces the availability of its Talaria TWO Matter v1.2 certified Wi-Fi solution. It is based on a single-chip SoC compared with the multiple-chip approach taken by many vendors. The Matter protocol addresses the need for vendor-independent device compatibility, easy setup, and operation. This allows the Talaria TWO Matter 1.2 solution to enable device interoperability across a variety of ecosystems, including Apple, Google, Amazon Alexa, Samsung, etc., providing a wider selection of home automation devices for smart home users.

“By 2030, ABI Research expects more than 1.5 billion Matter-compliant smart home devices to ship annually, many of which will be battery powered,” says Andrew Zignani, Senior Research Director, ABI Research. “InnoPhase IoT’s Talaria TWO solution combines its ultra-low power Wi-Fi with support for Matter 1.2 specification to deliver enhanced interoperability and extended battery life to key smart home IoT applications such as Wi-Fi enabled smart door locks, lighting, thermostats, and sensor solutions. This will be critical in providing an enhanced customer experience, up to 4x improvement in battery life, seamless provisioning via Bluetooth Low Energy (BLE), and high levels of security.”

The Matter stack runs on the Talaria TWO SoC for both standalone and microcontroller (MCU) host configurations. The standalone operation provides the most power, size, and cost-efficient option. Flexibility is provided by allowing customers to use an external MCU host by offloading Matter protocol processing onto the Talaria TWO SoC so that developers can use MCU processing and memory resources specifically for custom applications. It also allows for the selection of a Cortex-M0 to Cortex-M85-based processor that is appropriate for the application. With a Matter over lowest-power Wi-Fi approach, rather than Matter over Thread, the Talaria TWO solution delivers a direct connection to the cloud/internet, eliminating the need and cost of a bridge border router.

The Talaria TWO Matter full-stack software development kit, SDK 3.1, is based on FreeRTOS and provides edge-to-cloud software for custom IoT applications, a GCC toolchain, and an eclipse-based IDE for software development. It also includes Matter 1.2 reference applications profiles for smart lighting and door locks with support for Amazon’s AWS and Microsoft Azure platforms. Additional profiles will be released in Q3 2024. The Talaria TWO Matter SDK3.1 is supported on the standalone Talaria TWO Evaluation Kit, as well as reference designs combining Talaria TWO modules with the Nuvoton M251 and Nuvoton M2354 MCU series hosts. The solution is scalable to other MCUs through a HAPI interface between Talaria TWO and MCU hosts.

“Nuvoton is excited to be working with InnoPhase IoT to deliver Matter 1.2 solutions,” said Chad Wu, Nuvoton Vice President of the Microcontroller Business Group. “Combining Nuvoton’s highly secure NuMicro® microcontrollers and microprocessors with InnoPhase IoT’s ultra-low power Talaria TWO Wi-Fi/BLE modules in a Matter reference design notably speeds up market entry for smart home device customers, enabling a rapid launch advantage.”

“Achieving Matter 1.2 certification is a game changer in secure device connectivity, ensuring that smart-home devices work together seamlessly,” said Wiren Perera, InnoPhase IoT President and COO. “Our Talaria TWO delivers Wi-Fi at ultra-low power levels synonymous with shorter range technologies, unleashing truly untethered secure IoT devices. Next, it was important to provide manufacturer and ecosystem-independent interoperability for consumers. A scalable Matter 1.2 certified capability addresses this challenge for a wide range of smart-home applications from appliances through entertainment and comfort to utilities and services,” Perera added.

The Talaria TWO Matter v1.2 solution is currently available. Customers can purchase the evaluation kit from InnoPhase IoT and its distributors and the M251+T2 and M2354+T2 reference designs from Nuvoton distributors. Matter SDK3.1 is available from the InnoPhase IoT website customer portal. Contact sales@innoPhaseiot.com for demonstrations.

InnoPhase IoT will showcase its Matter 1.2 certified solutions at Sensors Converge in Santa Clara, CA, June 24-26 at booth #917. Deepal Mehta, Senior Director of Marketing and Business Development, will present on the Cloud-To-Edge Architecture panel on Tuesday, June 25 at 3:20 p.m.

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Baya Systems today emerged from stealth mode to announce its software-driven IP technology portfolio designed to accelerate complex single-die and multi-die SoC designs. These innovations bolster the emerging chiplet economy and enable unprecedented scale for large-scale compute and AI processing.

Baya Systems technology simplifies the development process and reduces the risk, empowering designers to rapidly analyze, develop, optimize and deploy these complex systems. This enables highly energy-efficient data movement in single-die designs that can support over 4 terabyte/second throughput in a complex CPU cluster, culminating in multi-petabyte/second throughput in multi-chiplet designs for high-end AI installations.

With the exponential growth of computing requirements for artificial intelligence, best-in-class silicon vendors have consistently tried to scale performance efficiently by integrating various processors, including CPUs, GPUs, and neural network accelerators, into intelligent compute systems. This has led to a substantial challenge of efficient data movement across these different processors, and increasingly complex system and application software development. Baya Systems focuses on delivering hyper-efficient data movement that can be customized with efficient hardware-based coherency, correctness, and robustness to accelerate these platforms for applications across industries such as AI acceleration, data center, networking infrastructure, automotive and IoT.

“The rapid scaling in compute needed to support AI is bottlenecked by scaling silicon, memory, storage, and the increasingly huge amounts of data; requiring increasingly complex SoCs and chiplets,” said Kevin Krewell, Principal Analyst at TIRIAS Research. “The industry desperately needs a holistic way to design, analyze, and build intelligent fabrics to address this, and Baya seems to have the right ingredients to really drive the market forward.”

Baya Systems tackles the challenges of system design complexity, performance guarantees, high costs, and shrinking market windows in the SoC and chiplet industries. Its WeaverPro software platform supports the SoC designer from initial specification all the way to post-silicon tuning. Its WeaveIP provides components to build a unified fabric that has an extremely efficient, scalable transport architecture that maximizes performance and throughput, while minimizing latency, silicon footprint and power. Combined with advanced features for reliability and safety, this empowers designers to analyze, architect, customize, optimize and deploy complex SoCs and chiplets.

Baya’s solution is unique for the following reasons:

• Software-driven architecture exploration helps optimize design to achieve performance guarantees based on built-simulator.
• Engine to generate representative workloads from traffic specification.
• Best-in-class, flexible network that can achieve 3GHz in a 4-nanometer process technology.
• Algorithmic optimization that supports reuse and minimizes silicon and power footprints without compromising performance.
• Industry’s first IP to offer multi-level cache coherency for single/multi-die systems, radically reducing costs of coherency across these large-scale systems.
• Customizable protocol and multicast capabilities for advanced AI and CPU acceleration that support petabyte-level throughput.
• Correct-by-construction design generation that radically reduces risk of failure.
• WeaveIP supports standard protocols such as CHI, ACE5-Lite, AXI5 and extendable to others including CXL.
• Physically aware flow with modularity and tiling support for ease of implementation

“The semiconductor industry is at an inflection point in how to overcome the widening gap between memory performance and the processing needs of AI,” said Dr. Sailesh Kumar, CEO at Baya Systems. “These challenges are overwhelming the industry with design complexity, energy costs, and systems that are obsolete by the time they hit the market. Baya Systems is resolute in delivering foundational software, an industry-first, grounds-up fabric solution for future-proof multi-cluster and multi-chiplet designs, and a methodology that takes out the guesswork. I firmly believe that Baya unlocks the merchant chiplet market that is expected to grow to $107 billion by 2033.”

Baya Systems was founded by Kumar, an ex-Intel Fellow and former founder of Netspeed Systems; Dr. Eric Norige, and Joji Philip, who were also key contributors at Netspeed Systems. It is backed by leading investors Matrix and Intel Capital, and is led by Silicon Valley semiconductor veterans with extensive experience in processing and systems, who have driven important initiatives at AMD, ARM, Apple, Intel, Meta, and other leading processor companies.

“When we invest, we look for key market gaps, disruptive technologies that address them, and teams that have a compelling vision and execution muscle and the hunger to achieve it,” said Stan Reiss, general partner, Matrix Partners. “Baya tops all of them for a market that is desperate for solving the scale and chiplet problem with a technology that not just fills the gap but unleashes disruptive innovation, and a proven team that has had a consistent out-sized success in entrepreneurial and high-growth settings.”

The company makes its public debut at DAC 2024, Booth No. 2446, at Moscone West in San Francisco June 23-27.

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KORE, a global leader in Internet of Things (“IoT”) Solutions and pioneering IoT hyperscaler, and provider of IoT Connectivity, Solutions and Analytics, today announced Cradlepoint, the global leader in cloud-delivered LTE and 5G wireless network and security solutions, has awarded KORE the 2023 Enterprise Partner of the Year Award. Presented at Cradlepoint’s recent 2024 Global Partner Summit, the award recognizes significant achievements in partner-driven sales, solution architecture and customer service.

Cradlepoint recognizes channel partners in three categories: outstanding performance, commitment to customers and significant achievements over the last year. Each recognized channel partner has demonstrated exceptional year-over-year growth and a continued commitment to positioning and selling Cradlepoint’s entire portfolio of wireless and security solutions.

“This award is a tremendous honor for KORE. Being named Cradlepoint’s Enterprise Partner of the Year demonstrates our commitment to providing best-in-class cellular connectivity solutions for complex IoT deployments,” said Nick Gregory, director of OEM strategic partnerships for KORE. “Our team has built a deep understanding of Cradlepoint’s technology, allowing us to deliver seamless integration and exceptional service to our customers. This recognition strengthens our relationship with Cradlepoint, and together, we’re excited to unlock even more possibilities for the future of connected businesses.”

As enterprises strive to be more competitive in an evolving global economy, they are turning to new and innovative technologies that can help transform their businesses. However, innovation cannot be limited by location or complexity. Public and private cellular networking, coupled with modern security and traffic optimization, unlock new opportunities for innovative enterprises to grow their businesses anywhere with confidence. With 5G at the center of Cradlepoint’s solutions, companies can securely and efficiently create offices on wheels, use computer vision for safety and efficiency, create agile manufacturing environments and digitize business in rugged spaces.

KORE supports strategic channel partner relationships with a broad range of businesses, including major cellular operators, telecom providers, master agencies, device manufacturers, and system integrators who benefit from KORE’s differentiated, channel-focused offerings.

“The expansion of Cradlepoint’s portfolio to include private networks and our new NetCloud SASE, along with a simplified model for managed services, has enabled our partners to create a wireless-first network practice while adding on value-add services such as security and remote management,” said Eric Purcell, senior vice president of global partner sales at Cradlepoint. “We are appreciative of all of our resellers taking on new frontiers and creating unique practices that are accelerating LTE and 5G Wireless WAN and LAN adoption. KORE has worked hard to receive this recognition.”

To learn more about KORE, please visit korewireless.com. For more information on Cradlepoint’s Partner Program, visit https://cradlepoint.com/partners/for-partners/.

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Tata Elxsi, a global engineering and design company, announced today that it has joined forces with Red Hat, the world’s leading provider of traditional operating system, to make moving applications in 5G multi-cloud environment for Telcos and MVNOs.

The partnership aims to leverage OpenShift, Red Hat’s container platform, as a common and uniform container-as-a-service (CaaS) layer across multi-cloud environments and Neuron as Tata Elxsi Multi-layer Automation Platform enabling seamless cloud automation, 5G Application placement and modernisation.

Tata Elxsi and Red Hat will work together on 5G Connected Car using TETHER, Tata Elxsi CVP Platform and Red Hat In-Vehicle OS that introduces Edge Analytics, In-Vehicle data processing and management with MlOps.

Tata Elxsi will provide its proven expertise and award-winning solutions in Connected Vehicle segment coupled with capabilities in 5G network design, orchestration, automation and testing. Together, Tata Elxsi and Red Hat will help global operators in network monetisation through innovative applications in Automotive, Healthcare and other sectors.

Vivek Tiwari, Vice President, Telco 5G Business Unit Tata Elxsi said, “As we embrace the era of Telco 5G in Automotive, Healthcare & Industry 4.0, Telcos are leading the way in creating customer-focused services and adopting new network technologies, that require a shift towards Cloudification, Hybrid/Multi- cloud adoption (Red Hat as a uniform CaaS layer across Multi-cloud networks), DevSecOps, AI/MlOps & End-to-end automation. We are excited to enable this with Tata Elxsi and Red Hat together. We enable Telco 5G Multi-Cloud Automation with Edge Analytics to deliver a distinctive service for our clients.”

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Klika Tech’s solution, developed in collaboration with AWS and Seeed Studio, addresses connectivity challenges in deploying large fleets of low-power IoT devices for industrial and consumer sectors. Utilizing technologies like LoRaWAN, NB-IoT, and CoAP, Klika Tech integrates the Seeed Studio SenseCAP T1000 LoRaWAN Tracker and Wio Tracker 1110 Dev Board, powered by Nordic nRF52840 and Semtech LR1110, to efficiently collect and analyze Location and Environmental data on AWS. Advanced data analytics and visualization capabilities further enhance business insights.

“It is my pleasure to recognize Klika Tech with an IoT Evolution Asset Tracking Award for its continued innovation,” said Carl Ford, Community Developer, IoT Evolution World. “As a leader in this rapidly evolving industry, I look forward to seeing Klika Tech’s future successes.”

“Our collaboration with AWS and Seeed Studio exemplifies our commitment to innovation and excellence in IoT solutions,” said Gennadiy Borisov, President and Co-CEO of Klika Tech. “This award-winning asset tracking solution highlights our ability to address complex connectivity challenges and deliver scalable, cost-effective solutions that drive significant business value for our clients.”

“We’re excited to collaborate with Klika Tech to deliver this comprehensive tracking solution on AWS,” commented Joey Jiang, VP at Seeed Studio. “As the AIoT hardware provider, we firmly believe that our reliable hardware devices, combined with Klika Tech’s innovative software, will create a transformative asset tracking solution for various industries.”

IoT Evolution Magazine is dedicated to recognizing and celebrating the leaders driving innovation in the Internet of Things sector. By presenting awards such as the IoT Evolution Asset Tracking Award, the publication highlights the advancements and achievements of companies that are pushing the boundaries of IoT technology. Their commitment to acknowledging these contributions fosters growth, encourages new developments, and underscores the importance of IoT in transforming industries and improving everyday life.

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Propelling 5G-A (5G-Advanced) Deployment with Innovative Modules and Solutions

Under the discourse on 5G advancement, Fibocom highlights the transformative potential of 5G-A with continuous innovations. 5G-A is promised to enhance 5G capabilities significantly by providing lightning-fast communication speeds, up to 100 times faster than 5G with peak speeds reaching 1 Tbps, while reducing latency and enabling 10 times more device connections. Wide-ranging innovations are emerging across industries to leverage 5G-A.

Plentiful AIoT devices embedded with Fibocom’s latest 5G modules were displayed to illustrate diversified applications, including CPEs for in-home connectivity, ODUs and mobile hotspots for outdoor internet access, and routers and trackers applied in the industrial industry. The 5G Gateway embedded with Fibocom’s FG360 can support Wi-Fi Connectivity: 11ax 4×4 2.4G; 11ax 4×4 5G Seamless roaming. Integrated with Fibocom’s FG160, the 5G Dongle can offer the 5G NR Sub 6 SA/NSA for variant devices like laptops, VR HMD, Drones, Robots, and Stream Gaming. Powered by Fibocom’s NL668, the T-Box is a built-in intelligent LTE modem with self-diagnosis, remote telecom carrier switch, and auto-restore.

On the first day of the event, Fibocom unveiled the expansion of its 5G RedCap product lineup by introducing the Mediatek-T300-embedded module FG332 and the FG332-integrated CPE solution. Tailored to enhance RedCap Tech-enabled FWA applications like CPE (Customer Premise Equipment) and Dongle, the FG332 module features a LGA form factor packed into a compact 29x32mm PCB area, facilitating a flexible product design for next-level wireless experience.

Featuring the intuitive design for fast and stable connections, all of Fibocom’s module-embedded FWA PCBA solutions were showcased on-site, Illustrating a plug-and-play FWA experience thoroughly.

Embracing AI-Empowered Connectivity

The integration of AI in communication systems has announced a new era of enhanced connectivity. By leveraging vast datasets, AI has revolutionized cellular transmission, optimizing signal efficiency and paving the way for faster data transfers. At Fibocom’s booth, visitors witnessed firsthand the transformative power of AI in communication, with a showcase of smart modules and devices tailored for diverse applications.

The ECR (Electronic Cash Registers) based on the Fibocom SC138 smart  Module is equipped with intelligent dual touch screens for a next-level user experience. Embedded with Fibocom SC126 smart Module, the Rugged Tablet PC features IEEE 802.11a/b/g/n/ac, 2.4G, and 5G Dual-band fingerprint entry, image collection, etc. Also, the panoramic cameras enabled by the Qualcomm QCS605 solution can capture 360-degree vertical and horizontal full-space images.

COMPUTEX is ongoing, and visitors are welcome to visit Fibocom’s booth at #K1215a in Hall 1. Join us in prospering AIoT in the New Era!

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Afero today announced it has become the first secure IoT platform company to sign the Secure by Design pledge from the U.S. Cybersecurity and Infrastructure Security Agency (CISA). This significant step highlights Afero’s dedication to delivering enterprise-grade security for IoT endpoints, including devices without enough memory and processing power to run traditional operating systems.

“Our mission at Afero has always been to enable connected devices to be smart and secure,” said Joe Britt, CEO and Co-founder of Afero. “By signing the CISA Secure by Design pledge, we are reinforcing our commitment to leading the IoT industry with robust security measures that extend all the way to the endpoint, even the most constrained devices. This pledge aligns perfectly with our core values and ongoing efforts to safeguard the IoT supply chain.”

The CISA Secure by Design pledge is a voluntary commitment to improve the security of enterprise software products and services, including on-premises software, cloud services, and software as a service (SaaS). While the pledge does not currently include physical products such as IoT devices and consumer products, Afero has been committed since its founding to extending this same secure-by-design philosophy down to physical products such as high-volume consumer devices.

“The surging demand for connected devices will make IoT security more critical than ever,” said Bret Jordan, Afero’s Chief Security Strategist. “Afero is at the forefront of securing this hyperconnected edge, ensuring every device, no matter how small, remains secure. As the first IoT platform player to sign the CISA pledge, we’re demonstrating Afero’s unwavering dedication to this cause.”

Afero is a leading PaaS for IoT manufacturers and retail brands. Utilizing enterprise-grade, end-to-end security and data privacy through the entire supply chain, Afero provides comprehensive device security — from the factory floor to the consumer’s home. Afero’s unique technology embeds security into each device that cannot be disabled. With more than 120 IoT patents, Afero has revolutionized the IoT device onboarding process, enabling devices to be securely connected in seconds.

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